Adsorption promises to play an integral role in several future energy and environmental technologies, including hydrogen storage, CO removal for fuel cell technology, desulfurization of transportation fuels, and technologies for meeting higher standards on air and water pollutants. Ralph Yang's Adsorbents provides a single and comprehensive source of knowledge for all commercial and new sorbent materials, presenting the fundamental principles for their syntheses, their adsorption properties, and their present and potential applications for separation and purification. Chapter topics in this authoritative, forward-looking volume include: – Formulas for calculating the basic forces or potentials for adsorption – Calculation of pore-size distribution from a single adsorption isotherm – Rules for sorbent selection – Fundamental principles for syntheses/preparation, adsorption properties, and applications of commercially available sorbents – Mesoporous molecular sieves and zeolites -¸-complexation sorbents and their applications – Carbon nanotubes, pillared clays, and polymeric resins Yang covers the explosion in the development of new nanoporous materials thoroughly, as the adsorption properties of some of these materials have remained largely unexplored. The whole of this book benefits from the new adsorbent designs made possible by the increase in desktop computing and molecular simulation, making Adsorbents useful to both practicing laboratories and graduate programs. Ralph Yang's comprehensive study contributes significantly to the resolution of separation and purification problems by adsorption technologies.
This book documents CCPS's Aerosol Research Program to develop a model to predict liquid rainout from release of a pressurized, liquefied gas–and, hence the residual amount of material in a vapor cloud, which may be greater than the amount calculated from an enthalpy chart. RELEASE predicts the rate of fluid discharge, the depressurization, flashing and formation of liquid drops, the entrainment of drops into the vapor cloud, the subsequent spreading of the jet, and rate of liquid rainout to a pool on the ground. Designed in a modular fashion to permit adjustment and corrections as new data become available, its multi-layered approach contains sub-models that include the complexities of many variables, including the effect of liquid superheat, rate of bubble growth, criterion for bubble formation, and heat transfer from the liquid to the growing vapor bubble. To validate RELEASE, CCPS conducted small- and large-scale experiments using superheated water, heated liquefied chlorine, methylamine, and cyclohexane that produced valuable data in an area where data are scarce. This book gives complete access, in text and on CD-ROM, to the model and the test data, giving users an informed ability to apply the model to their own work.
This indispensable collection of seminal papers on ferroelectricity provides an overview over almost a hundred years of basic and applied research. Containing historic contributions from renowned authors, this book presents developments in an area of science that is still rapidly growing. Although primarily aimed at scientists and academics involved in research, this will also be of use to students as well as newcomers to the field.
RapidIO – The Embedded System Interconnect brings together one essential volume on RapidIO interconnect technology, providing a major reference work for the evaluation and understanding of RapidIO. Covering essential aspects of the specification, it also answers most usage questions from both hardware and software engineers. It will also serve as a companion text to the specifications when developing or working with the RapidIO interconnect technology. Including the history of RapidIO and case of studies of RapidIO deployment, this really is the definitive reference guide for this new area of technology.
The rapid growth of miniaturisation to meet the demand for increasingly smart devices is driving global investment in a wide range of industries such as IT, electronics, energy, biotechnology and materials science. Nanotechnology: Global Strategies, Industry Trends and Applications, written by experts from Asia, Europe and the USA, gives a comprehensive and important global perspective on nanotechnology. The book is divided into 3 parts: National Nanotechnology Initiatives in Asia, Europe and the USAexplores the current status of nanotechnology in China, Korea, Europe and the USA. Investing in Nanotechnology provides practical information about the opportunities and risks involved in nanotechnology and predictions for future growth. Frontiers of Nanotechnology discusses future applications of the technology and the real-world issues surrounding these. Outlining developing trends, emerging opportunities, associated risks and future applications, this book is essential reading for professionals, prospective investors and policy makers who need an accessible introduction to the topic.
The goal of this book is to provide engineers and researchers the tools necessary for modelling, experimenting, and simulating these microflows as a preliminary step for designing and optimizing fluidic microsystems. The various consequences of miniaturization on the hydrodynamics of gas, liquid or two-phase flows, as well as associated heat transfer are analysed. The book is illustrated with examples showing the diversity and the originality of fluidic microsystems.
Recent advances in nanomedicine offer ground-breaking methods for the prevention, diagnosis and treatment of some fatal diseases. Amongst the most promising nanomaterials being developed are magnetic nanomaterials, including magnetic nanoparticles and magnetic nanosensors. Some nanomagnetic medical applications are already commercially available with more set to be released over the coming years. Nanomedicine, Design and Applications of Magnetic Nanomaterials, Nanosensors and Nanosystems presents a comprehensive overview of the biomedical applications of various types of functional magnetic materials. The book provides an introduction to magnetic nanomaterials before systematically discussing the individual materials, their physical and chemical principles, fabrication techniques and biomedical applications. This methodical approach allows this book to be used both as a textbook for beginners to the subject and as a convenient reference for professionals in the field. Discusses magnetic nanoparticles including nanowires, nanotubes, zero-dimensional nanosperes and naturally existing magnetosomes. Examines intrinsically smart magnetic materials and describes their part in the development of biomedical sensors and biochips, which are often used in biomedical tests. Integrates the research efforts of different disciplines – from materials sciences to biology and electrical engineering to medicine – in order to provide a unified and authoritative guide to a richly interdisciplinary field. This volume is of great appeal to students and researchers in the fields of electrical and electronic engineering, biomedical engineering, nanotechnology, materials science, physics, medicine and biology. It is also of interest to practising engineers, materials scientists, chemists and research medical doctors involved in the development of magnetic materials and structures for biomedical applications.
Electrostatic discharge (ESD) failure mechanisms continue to impact semiconductor components and systems as technologies scale from micro- to nano-electronics. This book studies electrical overstress, ESD, and latchup from a failure analysis and case-study approach. It provides a clear insight into the physics of failure from a generalist perspective, followed by investigation of failure mechanisms in specific technologies, circuits, and systems. The book is unique in covering both the failure mechanism and the practical solutions to fix the problem from either a technology or circuit methodology. Look inside for extensive coverage on: failure analysis tools, EOS and ESD failure sources and failure models of semiconductor technology, and how to use failure analysis to design more robust semiconductor components and systems; electro-thermal models and technologies; the state-of-the-art technologies discussed include CMOS, BiCMOS, silicon on insulator (SOI), bipolar technology, high voltage CMOS (HVCMOS), RF CMOS, smart power, gallium arsenide (GaAs), gallium nitride (GaN), magneto-resistive (MR) , giant magneto-resistors (GMR), tunneling magneto-resistor (TMR), devices; micro electro-mechanical (MEM) systems, and photo-masks and reticles; practical methods to use failure analysis for the understanding of ESD circuit operation, temperature analysis, power distribution, ground rule development, internal bus distribution, current path analysis, quality metrics, (connecting the theoretical to the practical analysis); the failure of each key element of a technology from passives, active elements to the circuit, sub-system to package, highlighted by case studies of the elements, circuits and system-on-chip (SOC) in today’s products. ESD: Failure Mechanisms and Models is a continuation of the author’s series of books on ESD protection. It is an essential reference and a useful insight into the issues that confront modern technology as we enter the Nano-electronic era.
With the growth of high-speed telecommunications and wireless technology, it is becoming increasingly important for engineers to understand radio frequency (RF) applications and their sensitivity to electrostatic discharge (ESD) phenomena. This enables the development of ESD design methods for RF technology, leading to increased protection against electrical overstress (EOS) and ESD. ESD: RF Technology and Circuits: Presents methods for co-synthesizisng ESD networks for RF applications to achieve improved performance and ESD protection of semiconductor chips; discusses RF ESD design methods of capacitance load transformation, matching network co-synthesis, capacitance shunts, inductive shunts, impedance isolation, load cancellation methods, distributed loads, emitter degeneration, buffering and ballasting; examines ESD protection and design of active and passive elements in RF complementary metal-oxide-semiconductor (CMOS), RF laterally-diffused metal oxide semiconductor (LDMOS), RF BiCMOS Silicon Germanium (SiGe), RF BiCMOS Silicon Germanium Carbon (SiGeC), and Gallim Arsenide technology; gives information on RF ESD testing methodologies, RF degradation effects, and failure mechanisms for devices, circuits and systems; highlights RF ESD mixed-signal design integration of digital, analog and RF circuitry; sets out examples of RF ESD design computer aided design methodologies; covers state-of-the-art RF ESD input circuits, as well as voltage-triggered to RC-triggered ESD power clamps networks in RF technologies, as well as off-chip protection concepts. Following the authors series of books on ESD, this book will be a thorough overview of ESD in RF technology for RF semiconductor chip and ESD engineers. Device and circuit engineers working in the RF domain, and quality, reliability and failure analysis engineers will also find it a valuable reference in the rapidly growing are of RF ESD design. In addition, it will appeal to graduate students in RF microwave technology and RF circuit design.
The scaling of semiconductor devices from sub-micron to nanometer dimensions is driving the need for understanding the design of electrostatic discharge (ESD) circuits, and the response of these integrated circuits (IC) to ESD phenomena. ESD Circuits and Devices provides a clear insight into the layout and design of circuitry for protection against electrical overstress (EOS) and ESD. With an emphasis on examples, this text: explains ESD buffering, ballasting, current distribution, design segmentation, feedback, coupling, and de-coupling ESD design methods; outlines the fundamental analytical models and experimental results for the ESD design of MOSFETs and diode semiconductor device elements, with a focus on CMOS, silicon on insulator (SOI), and Silicon Germanium (SiGe) technology; focuses on the ESD design, optimization, integration and synthesis of these elements and concepts into ESD networks, as well as applying within the off-chip driver networks, and on-chip receivers; and highlights state-of-the-art ESD input circuits, as well as ESD power clamps networks. Continuing the author’s series of books on ESD, this book will be an invaluable reference for the professional semiconductor chip and system ESD engineer. Semiconductor device and process development, quality, reliability and failure analysis engineers will also find it an essential tool. In addition, both senior undergraduate and graduate students in microelectronics and IC design will find its numerous examples useful.