Химия
Различные книги в жанре ХимияSilicium- und Nanotechnologie für Lacksysteme
Die chemische Nanotechnologie ist die gezielte Herstellung von Systemen, Materialien oder Komponenten mit nanoskaligen Abmessungen durch chemische Synthese. Die Autoren liefern mit diesem Buch einen Überblick über alle wichtigen Felder der chemischen Nanotechnologie. Mit Beispielen aus der Glaschemie, der Silikonchemie und der Festkörperchemie, wird der Leser immer Schritt für Schritt zu den komplexeren Reaktionen der anorganisch-organischen Nanokomposite geführt. Darüber hinaus werden Reaktionsmechanismen der modernen Polymerchemie und die wichtigsten Charakterisierungsmethoden beschrieben.
Additives for Waterborne Coatings
This ebook offers an overview of the most important aspects and applications of additives for waterborne systems in diverse market segments. Wernfried Heilen helps to understand how additives work and elucidates all kinds of mechanisms in great detail. Furthermore he dispels a lot of myths surrounding paint additives with an excellent combination of theory and practice. This enables a deep insight into all the different application areas for additives in waterborne paint systems.
Electronic Packaging Science and Technology
Must-have reference on electronic packaging technology! The electronics industry is shifting towards system packaging technology due to the need for higher chip circuit density without increasing production costs. Electronic packaging, or circuit integration, is seen as a necessary strategy to achieve a performance growth of electronic circuitry in next-generation electronics. With the implementation of novel materials with specific and tunable electrical and magnetic properties, electronic packaging is highly attractive as a solution to achieve denser levels of circuit integration. The first part of the book gives an overview of electronic packaging and provides the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices, biomedical devices, and circuit integration. The last part of the book contains topics based on the science of electronic packaging and the reliability of packaging technology.
